Dry Process and Deposition Facilities in Clean Room Class 10000

Lithography
The key to device fabrication at a small scale is about precise control of geometric shapes, dimensions, and location of the pattern. As the minimum size of features are getting smaller, we adapt difference technologies for micro and nano lithography to deliver solution in high-resolution pattern transfer while considering the optimum cost and yield at the same time.

Thin film metal and dielectric
As the material properties differ from bulk thickness to the thin film and the device itself at a small scale, excellent technology for thin film deposition is crucial. We commit to provide several methods in thin film deposition for metal and dielectric (also including semiconductors and transparent conducting films) based on vacuum science and technology.

Chemical wet and physical dry etching
Selective material removing at micro and nano scale works slightly differently from macroscopic scale. Combined with lithography, etching or micro/nano machining of material is done either in our chemical wet bench, or by utilizing combination of both chemical and physical dry etching in a single technological solution.

Material heat and surface treatment
Heat treatment served different purposed depending on the application. Mainly we are capable in oxidation, annealing, and also nitridation for either carried out in small oven, conventional furnace, or high ramp rate furnace for rapid treatment. Oxygen plasma treatment which is available in our facility on the other hand treat the surface prior to post coating process and useful to etch very thin materials.

Growth and synthesis of new materials
New materials are prepared by variety of growth methods (and equipments) which is complementary available in our lab. In order to optimize growth or synthesis parameters, it is necessary to understand the properties of materials and strategically perturb crystal structure, transport, and thermodynamic properties of new materials at extreme conditions of temperatures and pressures. Few examples are including low dimensional carbon allotropes and novel micro/nano structures of metal oxides and semiconductors.

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